SmartKem supplies the full stack of materials for low-temperature OTFT devices including:

TRUFLEX^® Inks

Materials are formulated and filtered under clean room conditions and can be supplied in pack sizes of 100 mL, 500 mL, 1 L, and 3.5 L.

Redistribution Layer (RDL)

SmartKem has an optically transparent RDL layer suitable for applications requiring over-coating of copper interconnects (micro-LED) or wafer level packaging

• Transparency: ~100% @ visible light region
• Optical properties: b: -0.02 ; Haze : 0.1% ;
• Flatness: topography < 0.5um @10um ILD film
• Aspect ratio: 5
• Material processed at G2.5 size (370mm470mm) using ITRI (Taiwan) process line

G2.5 size test sample processed with SmartKem materials

SmartKem has the capability to generate OTFT demonstrators to help customers to generate proof-of-concept products. It has access to a range of facilities for prototyping and can tailor the design and process to meet a wide range of needs.